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  sn75123 dual line driver slls086c september 1973 revised april 1998 1 post office box 655303 ? dallas, texas 75265  meets or exceeds the requirements of ibm ? system 360 input/output interface specification  operate from single 5-v supply  ttl compatible  3.11-v output at i oh = 59.3 ma  uncommitted emitter-follower output structure for party-line operation  short-circuit protection  and-or logic configuration  designed for use with triple line receiver sn75124  designed to be interchangeable with n8t13 and n8t23 description the sn75123 is a dual line driver specifically designed to meet the input/output interface specifications for ibm system 360. it also is compatible with standard-ttl logic and supply-voltage levels. the sn75123 low-impedance emitter-follower outputs drive terminated lines such as coaxial cable or twisted pair. having the outputs uncommitted allows wired-or logic to be performed in party-line applications. output short-circuit protection is provided by an internal clamping network that turns on when the output voltage drops below approximately 1.5 v. all the inputs are in conventional ttl configuration, and the gating can be used during power-up and power-down sequences to ensure that no noise is introduced to the line. the sn75123 is characterized for operation from 0 c to 70 c. function table inputs output a b c d e f y h h h h x x h x xxxhh h all other input combinations l h = high level, l = low level, x = irrelevant copyright ? 1998, texas instruments incorporated production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. ibm is a trademark of international business machines corp. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1a 1b 1c 1d 1e 1f 1y gnd v cc 2f 2e 2d 2c 2b 2a 2y d or n package (top view) the sn751730 is recommended for new ibm 360/370 interface designs.
sn75123 dual line driver slls086c september 1973 revised april 1998 2 post office box 655303 ? dallas, texas 75265 logic symbol 2 2 this symbol is in accordance with ansi/ieee std 91-1984 and iec publication 617-12. 1 1a 2 1b 3 1c 4 1d 7 & 5 1e 6 1f 10 2a 11 2b 12 2c 13 2d 14 2e 15 2f 9 1 & logic diagram (positive logic) a b c d e f y
sn75123 dual line driver slls086c september 1973 revised april 1998 3 post office box 655303 ? dallas, texas 75265 schematic (each driver) v cc to other line driver 4 k w 4 k w a b c d e f gnd 360 w 15 w y to other line driver 1, 10 2, 11 3, 12 4, 13 5, 14 6, 15 8 16 7, 9 resistor values shown are nominal. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) 2 supply voltage, v cc (see note 1) 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage, v i 5.5 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . output voltage, v o 7 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous total dissipation at (or below) 25 c free-air temperature (see note 2): d package 950 mw . . . . . n package 1150 mw . . . . operating free-air temperature range, t a 0 c to 70 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg 65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 stresses beyond those listed under aabsolute maximum ratingso may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated under arecommended operating conditi onso is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. all voltage values, except differential input voltage, are with respect to network ground terminal. 2. for operation above 25 c free-air temperature, derate the d package to 608 mw at 70 c at the rate of 7.6 mw/ c and the n package to 736 mw at 70 c at the rate of 9.2 mw/ c. recommended operating conditions min nom max unit supply voltage, v cc 4.75 5 5.25 v high-level input voltage, v ih 2 v low-level input voltage, v il 0.8 v high-level output current, i oh 100 ma operating free-air temperature, t a 0 70 c
sn75123 dual line driver slls086c september 1973 revised april 1998 4 post office box 655303 ? dallas, texas 75265 electrical characteristics, v cc = 4.75 v to 5.25 v, t a = 0 c to 70 c (unless otherwise noted) parameter test conditions min max unit v ik input clamp voltage v cc = 5 v, i i = 12 ma 1.5 v v i(br) input breakdown voltage v cc = 5 v, i i = 10 ma 5.5 v v oh high level out p ut voltage v cc = 5 v, v ih = 2 v, t a = 25 c 3.11 v v oh high - le v el o u tp u t v oltage cc , ih , i oh = 59.3 ma, see note 3 t a = 0 c to 70 c 2.9 v v ol low-level output voltage v il = 0.8 v, i ol = 240 m a, see note 3 0.15 v i oh high level out p ut current v cc =5v v ih =45v v oh =2v t a =25 c see note 3 100 250 ma i oh high - le v el o u tp u t c u rrent v cc = 5 v , v ih = 4 . 5 v , v oh = 2 v , t a = 25 c , see note 3 100 250 ma i o(off) off-state output current v cc = 0, v o = 3 v 40 m a i ih high-level input current v i = 4.5 v 40 m a i il low-level input current v i = 0.4 v 0.1 1.6 ma i os short-circuit output current 2 v cc = 5 v, t a = 25 c 30 ma i cch supply current, outputs high v cc = 5.25 v, all inputs at 2 v, outputs open 28 ma i ccl supply current, outputs low v cc = 5.25 v, all inputs at 0.8 v, outputs open 60 ma 2 not more than one output should be shorted at a time. note 3: the output voltage and current limits are valid for any appropriate combination of high and low inputs specified by the function table for the desired output. switching characteristics, v cc = 5 v, t a = 25 c parameter test conditions min typ max unit t plh propagation delay time, low- to high-level output r l = 50 w , c l = 15 pf, see figure 1 12 20 ns t phl propagation delay time, high- to low-level output r l = 50 w , c l = 15 pf, see figure 1 12 20 ns t plh propagation delay time, low- to high-level output r l = 50 w , c l = 100 pf, see figure 1 20 35 ns t phl propagation delay time, high- to low-level output r l = 50 w , c l = 100 pf, see figure 1 15 25 ns parameter measurement information 5 ns 0 v v oh v ol 3v 5 ns input t plh output t phl voltage waveforms test circuit output pulse generator (see note a) 3 v v cc c l (see note b) r l = 50 w 90% 90% 1.5 v 1.5 v 10% 10% 1.5 v 1.5 v notes: a. the pulse generator has the following characteristics: z o = 50 w , t w = 200 ns, duty cycle = 50%. b. c l includes probe and jig capacitance. figure 1. test circuit and voltage waveforms
sn75123 dual line driver slls086c september 1973 revised april 1998 5 post office box 655303 ? dallas, texas 75265 typical characteristics output current ma v o output voltage v output current vs output voltage i o ?????? ?????? ?????? v cc = 5 v all inputs at 2 v t a = 25 c 300 250 200 150 100 50 0 01 23 45 figure 2 application information 1/2 sn75123 95 w 95- w coaxial cable a b c d e f a b y 1/3 sn75124 95 w strobe figure 3. unbalanced line communication using sn75123 and sn75124
package option addendum www.ti.com 10-jun-2014 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples sn75123d obsolete soic d 16 tbd call ti call ti 0 to 70 SN75123DR obsolete soic d 16 tbd call ti call ti 0 to 70 sn75123n active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type 0 to 70 sn75123n (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release.
package option addendum www.ti.com 10-jun-2014 addendum-page 2 in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.


important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? 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